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AS8221

Data Sheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only. Functional operation of the

device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 8 is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

-0.3

+50

V

-0.3

+7.0

V

-0.3

+7.0

V

DC Voltage at EN, STBN, ERRN, TxD, RxD,

TxEN, BGE, RxEN

-0.3

V

DC Voltage on pin WAKE, INH1, INH2

-0.3

DC Voltage at BP and BM

-40

+50

V

Input current (latchup immunity)

-100

100

mA

According to JEDEC 78

Electrostatic discharge at bus lines BP, BM,

-4

+4

kV

According to AEC-Q100-002

Electrostatic discharge

-2

+2

kV

According to AEC-Q100-002

Transient voltage on BP, BM

-200

+200

V

According to ISO7637 part3 test pulses a and b;

class C; RL=45

Ω, CL= 100 pF; (see Figure 18

on page 33).

-200

+200

V

According to ISO7637 part2 test pulses 1, 2, 3a

and 3b; class C; RL=45

Ω, CL= 100 pF; (see

Figure 18 on page 33).

+6.5

+50

V

According to ISO7637 part2 test pulse 4; class C;

RL=45

Ω, CL= 100 pF; (see Figure 18 on page

33).

+50

According to ISO7637 part2 test pulse 5b; class

C; RL=45

Ω, CL= 100 pF; (see Figure 18 on

page 33).

Total power dissipation (all supplies and outputs)

150

mW

Storage temperature

-55

+150

ºC

Junction temperature

-40

+150

ºC

Package body temperature

1

1. The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD-020C “Moisture/Reflow

Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. The lead finish for Pb-free leaded packages is matte tin

(100% Sn).

250

ºC

Humidity non-condensing

5

85

%