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PPC8572ECLPXATLD 数据表(PDF) 101 Page - Freescale Semiconductor, Inc |
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PPC8572ECLPXATLD 数据表(HTML) 101 Page - Freescale Semiconductor, Inc |
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101 / 140 page  MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4 Freescale Semiconductor 101 Package Description 18.2 Mechanical Dimensions of the MPC8572E FC-PBGA Figure 61 shows the preliminary mechanical dimensions of the MPC8572E FC-PBGA package with full lid. This is subject to change. Figure 61. Mechanical Dimensions of the MPC8572E FC-PBGA with Full Lid NOTES: 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. All dimensions are symmetric across the package center lines unless dimensioned otherwise. 4. Maximum solder ball diameter measured parallel to datum A. 5. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 6. Parallelism measurement shall exclude any effect of mark on top surface of package. |
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