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STM32F103RCT7 数据表(PDF) 106 Page - STMicroelectronics

部件名 STM32F103RCT7
功能描述  High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
PDF  130 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32F103RCT7 数据表(HTML) 106 Page - STMicroelectronics

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Electrical characteristics
STM32F103xC, STM32F103xD, STM32F103xE
106/130
Doc ID 14611 Rev 8
Figure 58.
Typical connection diagram using the ADC
1.
Refer to Table 59 for the values of RAIN, RADC and CADC.
2.
Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy
this, fADC should be reduced.
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 59 or Figure 60,
depending on whether VREF+ is connected to VDDA or not. The 10 nF capacitors should be
ceramic (good quality). They should be placed them as close as possible to the chip.
Figure 59.
Power supply and reference decoupling (VREF+ not connected to VDDA)
1.
VREF+ and VREF– inputs are available only on 100-pin packages.
ai14150c
STM32F103xx
VDD
AINx
IL±1 µA
0.6 V
VT
RAIN(1)
Cparasitic
VAIN
0.6 V
VT
RADC(1)
12-bit
converter
CADC(1)
Sample and hold ADC
converter
VREF+
(see note 1)
STM32F103xx
VDDA
VSSA /VREF–
(see note 1)
1 µF // 10 nF
1 µF // 10 nF
ai14388b



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