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STM32F103RCT7 数据表(PDF) 116 Page - STMicroelectronics |
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STM32F103RCT7 数据表(HTML) 116 Page - STMicroelectronics |
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116 / 130 page ![]() Package characteristics STM32F103xC, STM32F103xD, STM32F103xE 116/130 Doc ID 14611 Rev 8 Figure 66. BGA pad footprint Table 69. Recommended PCB design rules (0.5mm pitch BGA) Dimension Recommended values Dpad ∅ = 300 µm (circular) - 250 µm recommended Dsm ∅ = 340 µm min (for 300 µm diameter pad) PCD pad size Cu - Ni (2-6 µm) - Au (0.2 µm max) – Non solder mask defined – Micro via under bump allowed |
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