ADE02SA datasheet(287/326 Pages) MACOM

287 / 326 page

Index/Matrixes

Catalog 1308390

Dimensions are in inches

Dimensions are shown for

USA: 1-800-522-6752

South America: 55-11-3611-1514

Issued 9-04

and millimeters unless otherwise

reference purposes only.

Canada: 1-905-470-4425

Hong Kong: 852-2735-1628

specified. Values in parentheses

Specifications subject

Mexico: 01-800-733-8926

Japan: 81-44-844-8013

www.tycoelectronics.com

or brackets are metric equivalents. to change.

C. America: 52-55-5-729-0425

UK: 44-141-810-8967

Catalog 1308390

Dimensions are in inches

Dimensions are shown for

USA: 1-800-522-6752

South America: 55-11-3611-1514

Issued 9-04

and millimeters unless otherwise

reference purposes only.

Canada: 1-905-470-4425

Hong Kong: 852-2735-1628

specified. Values in parentheses

Specifications subject

Mexico: 01-800-733-8926

Japan: 81-44-844-8013

www.tycoelectronics.com

or brackets are metric equivalents. to change.

C. America: 52-55-5-729-0425

UK: 44-141-810-8967

Soldering Process Recommendation Guide

The majority of customers utilizing miniature or sub-

miniature switches in the industry today have a great concern

about the switches' capabilities during their soldering and

cleaning cycles. This concern centers around the introduction

of contaminates into the switch contact area which could

cause the switch to experience various failure modes either

immediately or during the life of the switch.

These failure modes can show in a number of manners.

The following are just a few examples: high contact

resistance, open contacts, low dielectric strength, and high

actuation forces causing use-related malfunctions. Since

most fluxes become active with the introduction of high

temperatures used in all soldering techniques, the switch

SOLDERING TYPES

A. WAVE SOLDERING

Top & Bottom board preheat: 200°F (93°C) for approximately 3 to 4 minutes.

Solder Temperature & Dwell Time: 500°F (260°C) for approximately 3 to 5 seconds.

B. HAND SOLDERING

1. 500°F-600°F (260°C-316°C) Utilizing a controlled 40 watt iron for 3 to 5 seconds maximum.

2. 500°F (260°C) Utilizing a controlled 30 watt iron for 10 seconds maximum.

C. DIP SOLDERING

1. Solder Temperature & Dwell Time: 500°F (260°C) for 3-5 seconds maximum.

2. Mounted on PCB .060" thick - Solder Temperature & Dwell Time: 500°F (260°C) for 10 seconds maximum.

D. SURFACE MOUNT

Tyco Electronics performs testing of their Surface Mount switches in accordance with EIA-364-56, Resistance to

Soldering Heat, test procedures 4 (Vapor Phase) and Procedure 5 (Infrared).

CLEANING TYPES

A. Solvent Wash (1.1.1 Trichlorethylene, T.M.S., T.M.C.)

B. Vapor Degreasing

C. Solvent Immersion

D. Aqueous Cleaning

must either prevent these fluxes from entering into its contact

area or allow cleaning techniques to carry flux particles out.

It must be understood that switch contamination can occur

during any procedure: from hand soldering to Surface Mount

systems for solder reflow.

We at Alcoswitch offer a wide range of switches to handle

any soldering operations. However, certain soldering

conditions will not apply to all switches. The following

conditions and charts should help assist you in the soldering

of our switches in your application. If you need additional

information, please contact the factory.

ADE02SA 数据表(PDF) 287 Page - Tyco Electronics

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