Data Sheet G10239EJ3V0DS00

9

µµµµ PC1943,1944

RECOMMENDED SOLDERING CONDITIONS

When soldering these products, there are highly recommended to observe the conditions as shown below.

If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to

consult with our sales offices.

For more details, refer to our document “Semiconductor Device Mounting Technology Manual” (C10535E).

Type of Surface Mount Device

µµµµ PC1943T, 1944T : Power mini mold (SOT-89)

Process

Conditions

Symbol

Infrared ray reflow

Peak temperature: 235

°C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210

°C or higher),

Maximum number of reflow processes: 2 times.

IR35-00-2

VPS

Peak temperature: 215

°C or below (Package surface temperature),

Reflow time: 40 seconds or less (at 200

°C or higher),

Maximum number of reflow processes: 2 times.

VP15-00-2

Wave soldering

Solder temperature: 260

°C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120

°C or below (Package surface temperature).

WS60-00-1

Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.

µµµµ PC1944GR : 8-pin plastic SOP (5.72 mm (225))

Process

Conditions

Symbol

Infrared ray reflow

Peak temperature: 235

°C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210

°C or higher),

Maximum number of reflow processes: 1 time.

IR35-00-1

VPS

Peak temperature: 215 °C or below (Package surface temperature),

Reflow time: 40 seconds or less (at 200

°C or higher),

Maximum number of reflow processes: 1 time.

VP15-00-1

Wave soldering

Solder temperature: 260

°C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120

°C or below (Package surface temperature).

WS60-00-1

Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.

Type of Through-hole Device

µµµµ PC1944J : 3-pin plastic SIP (TO-92)

Process

Conditions

Wave soldering (only to leads)

Solder temperature: 260

°C or below, Flow time: 10 seconds or less.

Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure

that the package body does not get jet soldered.