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PIC16C925-S/CL 数据表(PDF) 165 Page - Microchip Technology |
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PIC16C925-S/CL 数据表(HTML) 165 Page - Microchip Technology |
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165 / 182 page ![]() 2001 Microchip Technology Inc. Preliminary DS39544A-page 163 PIC16C925/926 17.2 Package Details 64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) * Controlling Parameter Notes: Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-026 Drawing No. C04-085 15 10 5 15 10 5 β Mold Draft Angle Bottom 15 10 5 15 10 5 α Mold Draft Angle Top 0.27 0.22 0.17 .011 .009 .007 B Lead Width 0.23 0.18 0.13 .009 .007 .005 c Lead Thickness 16 16 n1 Pins per Side 10.10 10.00 9.90 .398 .394 .390 D1 Molded Package Length 10.10 10.00 9.90 .398 .394 .390 E1 Molded Package Width 12.25 12.00 11.75 .482 .472 .463 D Overall Length 12.25 12.00 11.75 .482 .472 .463 E Overall Width 7 3.5 0 7 3.5 0 φ Foot Angle 0.75 0.60 0.45 .030 .024 .018 L Foot Length 0.25 0.15 0.05 .010 .006 .002 A1 Standoff § 1.05 1.00 0.95 .041 .039 .037 A2 Molded Package Thickness 1.20 1.10 1.00 .047 .043 .039 A Overall Height 0.50 .020 p Pitch 64 64 n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS* INCHES Units c 2 1 n D D1 B p #leads=n1 E1 E A2 A1 A L CH x 45 ° β φ α (F) Footprint (Reference) (F) .039 1.00 Pin 1 Corner Chamfer CH .025 .035 .045 0.64 0.89 1.14 § Significant Characteristic |
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