MB9AAA0N datasheet(101/109 Pages) SPANSION

101 / 109 page

DataS h eet

MB9AAA0N_DS706-00067-2v0-E, June 30, 2015

CONFIDENTIAL



Package Dimensions

64-pin plastic LQFP

Lead pitch

0.50 mm

Package width ×

package length

10.00 mm × 10.00 mm

Lead shape

Gullwing

Lead bend

direction

Normal bend

Sealing method

Plastic mold

Mounting height

1.70 mm MAX

Weight

0.32 g

64-pin plastic LQFP

(FPT-64P-M38)

"A"

0.08(.003)

0.145 ± 0.055

(.006 ± .002)

0.08(.003) M

0.22±0.05

0.50(.020)

12.00±0.20(.472±.008)SQ

*10.00±0.10(.394±.004)SQ

INDEX

2010 FUJITSU SEMICONDUCTOR LIMITED F64038S-c-1-2

(Stand off)

Details of "A" part

0.10 ± 0.10

(.004±.004)

0.60 ± 0.15

0.25(.010)

0.50±0.20

(.020±.008)

(Mounting height)

.059–.004

+.008

–0.10

+0.20

1.50

0~8°

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Note 1) * : These dimensions do not include resin protrusion.

Note 2) Pins width and pins thickness include plating thickness.

Note 3) Pins width do not include tie bar cutting remainder.

(.009±.002)

(.024±.006)

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