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STM32F439VG 数据表(PDF) 219 Page - STMicroelectronics |
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STM32F439VG 数据表(HTML) 219 Page - STMicroelectronics |
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219 / 240 page  DocID024244 Rev 10 219/240 STM32F437xx and STM32F439xx Package information 233 Figure 96. UFBGA169 - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array recommended footprint Note: Non-solder mask defined (NSMD) pads are recommended. 4 to 6 mils solder paste screen printing process. F 0.450 0.500 0.550 0.0177 0.0197 0.0217 ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 117. UFBGA169 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.27 mm Dsm 0.35 mm typ. (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter. Table 116. UFBGA169 - 169-ball 7 x 7 mm 0.50 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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