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STM32L072KB 数据表(PDF) 130 Page - STMicroelectronics |
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STM32L072KB 数据表(HTML) 130 Page - STMicroelectronics |
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130 / 147 page  Package information STM32L072xx 130/147 DocID027100 Rev 3 Figure 52. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball ,grid array recommended footprint Note: Non solder mask defined (NSMD) pads are recommended. 4 to 6 mils solder paste screen printing process. e - 0.500 - - 0.0197 - F - 0.750 - - 0.0295 - ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 89. TFBGA64 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.27 mm Dsm 0.35 mm typ. (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter. Table 88. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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