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STM32L072CZ 数据表(PDF) 134 Page - STMicroelectronics |
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STM32L072CZ 数据表(HTML) 134 Page - STMicroelectronics |
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134 / 147 page ![]() Package information STM32L072xx 134/147 DocID027100 Rev 3 Device marking for WLCSP49 The following figure gives an example of topside marking versus ball A 1 position identifier location. Figure 56. WLCSP49 marking example (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering samples to run qualification activity. Table 91. WLCSP49 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed. |
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