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TNETV2667FIBZWT 数据表(PDF) 241 Page - Texas Instruments

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部件名 TNETV2667FIBZWT
功能描述  Fixed-Point Digital Signal Processor
PDF  249 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

TNETV2667FIBZWT 数据表(HTML) 241 Page - Texas Instruments

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TMS320C6424
www.ti.com
SPRS347D – MARCH 2007 – REVISED DECEMBER 2009
7.2
Thermal Data for ZDU
Table 7-2. Thermal Resistance Characteristics (PBGA Package) [ZDU]
NO.
°C/W(1)
AIR FLOW (m/s)(2)
1
R
ΘJC
Junction-to-case
7.7
N/A
2
R
ΘJB
Junction-to-board
10.5
N/A
3
19.7
0.00
4
R
ΘJA
Junction-to-free air
15.5
1.0
5
14.3
2.00
7
4.9
0.00
8
PsiJT
Junction-to-package top
5.1
1.0
9
5.2
2.00
11
10.4
0.00
12
PsiJB
Junction-to-board
9.8
1.0
13
9.6
2.00
(1)
The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC
defined 1S2P system and will change based on environment as well as application.
For more information, see these three EIA/JEDEC standards:
•
EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
•
EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
(2)
m/s = meters per second
7.3
Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
Copyright © 2007–2009, Texas Instruments Incorporated
Mechanical Data
241
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Product Folder Link(s): TMS320C6424



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