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STM32F072CB 数据表(PDF) 101 Page - STMicroelectronics |
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STM32F072CB 数据表(HTML) 101 Page - STMicroelectronics |
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101 / 128 page  DocID025004 Rev 5 101/128 STM32F072x8 STM32F072xB Package information 124 Figure 36. Recommended footprint for UFBGA100 package b 0.240 0.290 0.340 0.0094 0.0114 0.0134 D 6.850 7.000 7.150 0.2697 0.2756 0.2815 D1 - 5.500 - - 0.2165 - E 6.850 7.000 7.150 0.2697 0.2756 0.2815 E1 - 5.500 - - 0.2165 - e - 0.500 - - 0.0197 - Z - 0.750 - - 0.0295 - ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 72. UFBGA100 recommended PCB design rules Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the solder mask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Table 71. UFBGA100 package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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