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STM32L151CCU6 数据表(PDF) 102 Page - STMicroelectronics |
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STM32L151CCU6 数据表(HTML) 102 Page - STMicroelectronics |
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102 / 136 page ![]() Electrical characteristics STM32L151xC STM32L152xC 102/136 DocID022799 Rev 12 Figure 30. Maximum dynamic current consumption on VREF+ supply pin during ADC conversion General PCB design guidelines Power supply decoupling should be performed as shown in Figure 12. The applicable procedure depends on whether VREF+ is connected to VDDA or not. The 100 nF capacitors should be ceramic (good quality). They should be placed as close as possible to the chip. ADC clock Sampling (n cycles) Conversion (12 cycles) Iref+ 300µA 700µA MS36686V1 Table 58. Maximum source impedance RAIN max(1) Ts (µs) RAIN max (kΩ) Ts (cycles) fADC=16 MHz(2) Multiplexed channels Direct channels 2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 0.25 Not allowed Not allowed 0.7 Not allowed 4 0.5625 0.8 Not allowed 2.0 1.0 9 1 2.0 0.8 4.0 3.0 16 1.5 3.0 1.8 6.0 4.5 24 3 6.8 4.0 15.0 10.0 48 6 15.0 10.0 30.0 20.0 96 12 32.0 25.0 50.0 40.0 192 24 50.0 50.0 50.0 50.0 384 1. Guaranteed by design. 2. Number of samples calculated for fADC = 16 MHz. For fADC = 8 and 4 MHz the number of sampling cycles can be reduced with respect to the minimum sampling time Ts (µs), |
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