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STM32L151CCU6 数据表(PDF) 123 Page - STMicroelectronics |
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STM32L151CCU6 数据表(HTML) 123 Page - STMicroelectronics |
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123 / 136 page  DocID022799 Rev 12 123/136 STM32L151xC STM32L152xC Package information 135 Figure 45. UFBGA100, 7 x 7 mm, 0.5 mm pitch, package recommended footprint eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 71. UFBGA100, 7 x 7 mm, 0.50 mm pitch, recommended PCB design rules Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Table 70. UFBGA100, 7 x 7 mm, 0.5 mm pitch package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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