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MPXM2010GS 数据表(PDF) 157 Page - Motorola, Inc

部件名 MPXM2010GS
功能描述  Sensor
PDF  670 Pages
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制造商  MOTOROLA [Motorola, Inc]
网页  http://www.freescale.com
标志 MOTOROLA - Motorola, Inc

MPXM2010GS 数据表(HTML) 157 Page - Motorola, Inc

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3–11
Motorola Sensor Device Data
www.motorola.com/semiconductors
Unibody Cross–sectional Drawings
Figure 9. Cross–Sectional Diagrams (not to scale)
SILICONE GEL
DIE COAT
WIRE BOND
LEAD FRAME
DIFFERENTIAL/GAUGE
DIE
STAINLESS STEEL
METAL COVER
EPOXY
CASE
DIFFERENTIAL/GAUGE ELEMENT
DIE
BOND
SILICONE GEL
DIE COAT
WIRE BOND
LEAD FRAME
ABSOLUTE
DIE
STAINLESS STEEL
METAL COVER
EPOXY
CASE
DIE
BOND
ABSOLUTE ELEMENT
P1
P2
P1
Figure 9 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from harsh environments, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX series pressure sensor operating characteristics
and internal reliability and qualification tests are based on use
of dry air as the pressure media. Media other than dry air may
have adverse effects on sensor performance and long term
stability. Contact the factory for information regarding media
compatibility in your application.
Figure 10. Cross–Sectional Diagram (not to scale)
FLUORO SILICONE
DIE COAT
WIRE BONDS
LEAD FRAME
DIE
STAINLESS STEEL
METAL COVER
EPOXY CASE
P1
Figure 10 illustrates the differential/gauge die in the
basic chip carrier (Case 473). A silicone gel isolates the
die surface and wirebonds from the environment, while
allowing the pressure signal to be transmitted to the
silicon diaphragm.
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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