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MPX2202DP 数据表(PDF) 578 Page - Motorola, Inc |
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MPX2202DP 数据表(HTML) 578 Page - Motorola, Inc |
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578 / 670 page  3–432 Motorola Sensor Device Data www.motorola.com/semiconductors PACKAGE OUTLINE DIMENSIONS (continued) CASE 1317–03 ISSUE B 0.025 0.298 0.050 A M 0.004 B C 0.165 0.280 A B C NOTES: 1. ALL DIMENSIONS ARE IN INCHES. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M–1994. 3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006 INCHES PER SIDE. 4. ALL VERTICAL SURFACES TO BE 5 ° MAXIMUM. 5. DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 INCHES MAXIMUM. 0.004 A 0.006 B C GAGE PLANE DETAIL E 0.023 0.010 .010 8X 0.014 2X DETAIL E SEATING PLANE 0.019 0.300 0.280 0.300 0.400 0.420 3 5 0.278 0.145 0.002 0.013 ° 10 0 ° 3 Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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