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MPX2202DP 数据表(PDF) 238 Page - Motorola, Inc

部件名 MPX2202DP
功能描述  Sensor
PDF  670 Pages
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制造商  MOTOROLA [Motorola, Inc]
网页  http://www.freescale.com
标志 MOTOROLA - Motorola, Inc

MPX2202DP 数据表(HTML) 238 Page - Motorola, Inc

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MPX4250A MPXA4250A SERIES
3–92
Motorola Sensor Device Data
www.motorola.com/semiconductors
ORDERING INFORMATION – UNIBODY PACKAGE (CASE 867)
The MPX4250A series pressure sensors are available in the basic element package or with pressure
port fittings that provide mounting ease and barbed hose connections.
Device Type/Order No.
Options
Case No.
Marking
MPX4250A
Basic Element
867
MPX4250A
MPX4250AP
Ported Element
867B
MPX4250AP
ORDERING INFORMATION – SMALL OUTLINE PACKAGE (CASE 482)
The MPXA4250A series pressure sensors are available in the basic element package or with a
pressure port fitting. Two packing options are offered for each type.
Device Type/Order No.
Case No.
Packing Options
Device Marking
MPXA4250A6U
482
Rails
MPXA4250A
MPXA4250A6T1
482
Tape and Reel
MPXA4250A
MPXA4250AC6U
482A
Rails
MPXA4250A
MPXA4250AC6T1
482A
Tape and Reel
MPXA4250A
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
fottprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and short-
ing between solder pads.
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
Figure 5. SOP Footprint (Case 482)
inch
mm
SCALE 2:1
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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