捷径   L1F-R(1) 被推存结果. 如同   No Data 开始   No Data 结尾  *SL1F-R(1) 包括   No Data 制造商

制造商 部件名 数据表 功能描述 VoltarisTech Inc ESL1F-R 430Kb/2P SURFACE MOUNT ULTRAFAST GLASS PASSIVATED JUNCTION RECTIFIER Rev.A2 Search Partnumber : Start with "L1F-R" - Total : 10 ( 1/1 Page) Lumileds Lighting Compa... L1F3-U380200006000 1Mb/24P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology L1F3-U380200006000 1Mb/2P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology L1F3-U380200006000 1Mb/23P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology 20180531 L1F3-U380200008000 1Mb/24P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology L1F3-U380200008000 1Mb/2P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology L1F3-U380200008000 1Mb/23P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology 20180531 L1F3-U380200010000 1Mb/24P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology L1F3-U380200010000 1Mb/2P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology L1F3-U390200010000 1Mb/24P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology L1F3-U390200010000 1Mb/2P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology L1F3-U390200012000 1Mb/24P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology L1F3-U390200012000 1Mb/2P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology L1F3-U390200012000 1Mb/23P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology 20180531 L1F3-U400200010000 1Mb/24P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology L1F3-U400200010000 1Mb/2P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology L1F3-U400200012000 1Mb/24P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology L1F3-U400200012000 1Mb/2P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology L1F3-U400200012000 1Mb/23P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology 20180531 L1F3-U400200014000 1Mb/24P Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology

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