| 制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd. |
0879200014
|
1Mb/13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, Tin (Sn) Overall Plating, with Pick-and-Place Cap
|
|
0879200830
|
1Mb/12P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 2.50關m (98關) Tin (Sn) Plating, with Pick-and-Place Cap
|
|
0879200833
|
1Mb/16P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 2.50關m (98關) Tin (Sn) Plating, with Pick-and-Place Cap, without Peg
|
|
0879202003
|
1Mb/16P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 20 Circuits, Tin (Sn) Overall Plating, with Pick-and-Place Cap, without Peg
|
|
0879208115
|
1Mb/13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Plating, with Pick-and-Place Cap, with Peg, Tape and Reel
|
|
0879208147
|
1Mb/13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Plating, with Pick-and-Place Cap, with Peg, Tube Packaging
|
|
0879209047
|
1Mb/13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, 2.50關m (98關) Tin (Sn) Plating, without Cap, with Peg, Tube Packaging, Lead-free
|
|
0879209311
|
1Mb/13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Overall Plating, with Cap, without Peg, Tape on Reel Packaging, Lead-free
|
|
0879209346
|
1Mb/13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 34 Circuits, Tin (Sn) Overall Plating, without Cap, without Peg, Tube Packaging, Lead-free
|
|
0879252000
|
225Kb/4P |
5.08mm (.200) Pitch, Power, 2.54mm (.100) Pitch, Signal, EXTreme PowerPlus??Pa-S Receptacle, Press-fit, Vertical, Power Alpha 24, Signal 10
|
|
0879253000
|
199Kb/4P |
6.35mm (.250) Pitch, Power, 2.54mm (.100) Pitch, Signal, EXTreme PowerPlus??Pa-S Receptacle, Press-fit, Vertical, 0.76關m (30關) Gold (Au)Plating, 33 Circuits
|
Bel Fuse Inc. |
0879-2C2R-Y4
|
792Kb/5P |
2X2 gigabit Magjack WITH UPPER AND LOWER LED (8 Cores) PATENTED
|
IXYS Corporation |
087900-00
|
200Kb/10P |
8-Channel, 60V Relay/Load Driver Open Drain Output, 3 Wire Interface
|
Molex Electronics Ltd. |
0879110407
|
498Kb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
|
0879110411
|
372Kb/6P |
2.54mm (.100") Pitch C-Grid짰 Header, Right Angle, Through Hole, 4 Circuits, 0.38關m Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
|
0879110611
|
372Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
|
0879110811
|
372Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
|
0879111011
|
372Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 10 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
|
0879111014
|
197Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 10 Circuits, 2.50關m (98關) Tin (Sn) Plating, Tube Packaging, Lead-free
|
|
0879111207
|
498Kb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 12 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
|
Chinese ▼ 
English
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand