| 制造商 | 部件名 | 数据表 | 功能描述 |
 RMT Ltd. |
1MC04-004-03
|
2Mb/9P |
Blank ceramics (not metallized) Metallized (Au plating)
|
|
1MC04-004-05
|
241Kb/4P |
Thermoelectric Module
|
|
1MC04-004-05
|
2Mb/9P |
Blank ceramics (not metallized) Metallized (Au plating)
|
|
1MC04-004-08
|
241Kb/4P |
Thermoelectric Module
|
|
1MC04-004-08
|
2Mb/9P |
Blank ceramics (not metallized) Metallized (Au plating)
|
|
1MC04-004-10
|
241Kb/4P |
Thermoelectric Module
|
|
1MC04-004-10
|
2Mb/9P |
Blank ceramics (not metallized) Metallized (Au plating)
|
|
1MC04-004-12
|
241Kb/4P |
Thermoelectric Module
|
|
1MC04-004-12
|
2Mb/9P |
Blank ceramics (not metallized) Metallized (Au plating)
|
|
1MC04-004-15
|
241Kb/4P |
Thermoelectric Module
|
|
1MC04-004-15
|
2Mb/9P |
Blank ceramics (not metallized) Metallized (Au plating)
|
|
1MC04-007-05
|
243Kb/4P |
Thermoelectric Module
|
|
1MC04-007-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MC04-007-08
|
243Kb/4P |
Thermoelectric Module
|
|
1MC04-007-08
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MC04-007-10
|
243Kb/4P |
Thermoelectric Module
|
|
1MC04-007-10
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MC04-007-12
|
243Kb/4P |
Thermoelectric Module
|
|
1MC04-007-12
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MC04-007-15
|
243Kb/4P |
Thermoelectric Module
|