| 制造商 | 部件名 | 数据表 | 功能描述 |
 RMT Ltd. |
1MD10-024-08
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MD10-024-08
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1MD10-024-10
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MD10-024-10
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1MD10-024-15
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MD10-024-15
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1MD10-024-20
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MD10-024-20
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1MD10-037-08
|
260Kb/2P |
Thermoelectric Module
|
|
1MD10-037-08
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MD10-037-08
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MD10-037-10
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MD10-037-15
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MD10-037-20
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MD10-049-08
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MD10-049-08
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1MD10-049-10
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MD10-049-10
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1MD10-049-15
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MD10-049-15
|
2Mb/8P |
Blank ceramics (not metallized)
|