| 制造商 | 部件名 | 数据表 | 功能描述 |
 RMT Ltd. |
4MC04-115-05
|
417Kb/4P |
Thermoelectric Module
|
|
4MC04-115-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
4MC04-115-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
4MC04-115-08
|
417Kb/4P |
Thermoelectric Module
|
|
4MC04-115-08
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
4MC04-115-10
|
417Kb/4P |
Thermoelectric Module
|
|
4MC04-115-10
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
4MC04-115-12
|
417Kb/4P |
Thermoelectric Module
|
|
4MC04-115-12
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
4MC04-115-15
|
417Kb/4P |
Thermoelectric Module
|
|
4MC04-115-15
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
4MC04115
|
2Mb/8P |
Thermoelectric Cooling Solutions
|
|
4MC06-103-05
|
250Kb/4P |
Thermoelectric Module
|
|
4MC06-103-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
4MC06-103-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
4MC06-103-08
|
250Kb/4P |
Thermoelectric Module
|
|
4MC06-103-08
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
4MC06-103-10
|
250Kb/4P |
Thermoelectric Module
|
|
4MC06-103-10
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
4MC06-103-12
|
250Kb/4P |
Thermoelectric Module
|