| 制造商 | 部件名 | 数据表 | 功能描述 |
 3M Electronics |
9662046702AR
|
276Kb/5P |
3M??Through-Board Socket
|
 Advantech Co., Ltd. |
9662132020E
|
541Kb/2P |
2U Rackmount Chassis for ATX/MicroATX Motherboard
|
|
9662132020E
|
785Kb/2P |
2U Rackmount Chassis for ATX/MicroATX Motherboard
|
|
9662132020E
|
1Mb/2P |
4U Rackmount Chassis for Full-size SHB/SBC
|
|
9662132020E
|
1Mb/2P |
4U Rackmount / Tower Chassis for EATX/ATX/MicroATX Motherboard with 8 Hot Swap Drive Trays
6-Aug-2021 |
|
9662191000E
|
531Kb/2P |
Intel Atom D525 AFC with Dual GigaLAN and 16 COM/Expansion Slots
|
|
9662410AJ00
|
436Kb/2P |
Explosion Proof LoRaWAN Wireless Condition Monitoring Sensor
23-Aug-2022 |
|
9662410AK00
|
436Kb/2P |
Explosion Proof LoRaWAN Wireless Condition Monitoring Sensor
23-Aug-2022 |
|
9662410AT00
|
436Kb/2P |
Explosion Proof LoRaWAN Wireless Condition Monitoring Sensor
23-Aug-2022 |
|
9662410AZ00
|
436Kb/2P |
Explosion Proof LoRaWAN Wireless Condition Monitoring Sensor
23-Aug-2022 |
 TE Connectivity Ltd |
966269-2
|
494Kb/3P |
AMPMODU II - 2.54mm [.100"] Centerline Board-to-Board Headers
Revised 1-04 |
|
966269-3
|
494Kb/3P |
AMPMODU II - 2.54mm [.100"] Centerline Board-to-Board Headers
Revised 1-04 |
|
966269-4
|
494Kb/3P |
AMPMODU II - 2.54mm [.100"] Centerline Board-to-Board Headers
Revised 1-04 |
|
966269-5
|
494Kb/3P |
AMPMODU II - 2.54mm [.100"] Centerline Board-to-Board Headers
Revised 1-04 |
|
966269-6
|
494Kb/3P |
AMPMODU II - 2.54mm [.100"] Centerline Board-to-Board Headers
Revised 1-04 |
|
966269-7
|
494Kb/3P |
AMPMODU II - 2.54mm [.100"] Centerline Board-to-Board Headers
Revised 1-04 |
|
966269-8
|
494Kb/3P |
AMPMODU II - 2.54mm [.100"] Centerline Board-to-Board Headers
Revised 1-04 |
|
966269-9
|
494Kb/3P |
AMPMODU II - 2.54mm [.100"] Centerline Board-to-Board Headers
Revised 1-04 |
 3M Electronics |
9662726702AR
|
276Kb/5P |
3M??Through-Board Socket
|
 ASM GmbH |
9660
|
451Kb/1P |
Clamp Sensors
|