0805HT-R15TGLD
AI

The **0805HT-R15TGLD** is a specific part number for a High-Temperature, Surface Mount (SMD) Wire-Wound Inductor, typically manufactured by **Coilcraft**.
Below is a detailed breakdown of its specifications and characteristics based on the alphanumeric code.
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## 1. Part Number Breakdown
The part number follows a standard convention used for high-performance inductors:
| Segment | Meaning | Detail |
| :--- | :--- | :--- |
| **0805** | Case Size | 0.08 x 0.05 inches (2.01 x 1.27 mm) |
| **HT** | Series | High Temperature / High Performance Wire-wound |
| **R15** | Inductance Value | R15 = 0.15 µH (or 150 nH) |
| **T** | Tolerance | ±10% (Commonly) |
| **G** | Termination | Gold-plated (RoHS compliant) |
| **L** | Packaging | Tape and Reel |
| **D** | Testing/Grade | Specific testing level or finish |
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## 2. Technical Specifications
These components are designed for RF (Radio Frequency) applications where stability and high "Q" factors are required.
### Electrical Characteristics
* **Inductance:** 150 nH (0.15 µH).
* **Quality Factor (Q):** Typically high (approx. 45–60 at 100 MHz).
* **Self-Resonant Frequency (SRF):** Usually around 1.2 GHz to 1.5 GHz.
* **DC Resistance (DCR):** Low resistance to minimize power loss (Approx 0.5 - 0.7 Ohms).
* **Current Rating (Irms):** Maximum current it can handle before heating up significantly (Approx 400-500 mA).
### Environmental & Mechanical
* **Wire-Wound Construction:** Provides better performance at high frequencies compared to multilayer inductors.
* **Temperature Range:** Often rated for -40°C to +125°C or higher (the "HT" designation).
* **Footprint:** Standard 0805 SMD footprint, making it compatible with most pick-and-place machines.
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## 3. Typical Applications
Due to its high-temperature stability and RF performance, this part is commonly used in:
1. **RF Impedance Matching:** Used in wireless communication devices to match antenna impedance.
2. **Filter Circuits:** Low-pass, high-pass, or band-pass filters in telecommunications.
3. **Broadband Amplifiers:** Decoupling and biasing circuits.
4. **Automotive/Industrial:** High-reliability environments where temperature fluctuations are common.
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## 4. Design Considerations
* **Orientation:** Wire-wound inductors can have polarity markers or dots. Ensure consistent orientation if crosstalk between adjacent components is a concern.
* **Proximity:** Avoid placing high-speed digital lines directly under the inductor to prevent magnetic coupling/interference.
* **Soldering:** Gold-plated terminations (the "G" in the code) are excellent for preventing oxidation but require appropriate solder profiles to ensure a strong intermetallic bond.
- ⤷What are the main differences between wire-wound and multilayer inductors in RF circuits?
- ⤷ How does the 'Q factor' impact the performance of this inductor?
- ⤷ Are there specific soldering temperature profiles recommended for gold-plated SMD parts?