The part number **507T175NF2103** refers to a high-performance **Micro-D Backshell** manufactured by **Glenair**. These components are critical in aerospace, defense, and high-reliability industrial electronics for protecting connectors and ensuring signal integrity. --- ### 1. Technical Specifications Breakdown The part number follows a specific nomenclature used by Glenair for their 507 series backshells. | Segment | Code | Description | | :--- | :--- | :--- | | **Series** | 507 | Micro-D Backshell (Standard) | | **Style** | T | Top Entry (The wire bundle exits straight out the top) | | **Material/Finish** | NF | Aluminum Alloy with Cadmium Olive Drab finish | | **Shell Size** | 21 | Designed for a 21-contact Micro-D connector | | **Hardware** | 03 | Female Jackpost (standard hardware for securing the shell) | --- ### 2. Functional Characteristics Electronic systems using this part benefit from three primary layers of protection: 1. **EMI/RFI Shielding:** The aluminum construction acts as a Faraday cage, protecting sensitive signals from electromagnetic interference and preventing the cable from emitting radiation. 2. **Strain Relief:** It prevents mechanical stress on the tiny solder or crimp joints inside the Micro-D connector, ensuring the wires don't pull out during vibration or handling. 3. **Environmental Protection:** The "NF" finish (Cadmium) provides excellent corrosion resistance, especially in salt-spray environments (common in naval or aviation applications). --- ### 3. Material Properties The finish is a critical aspect of this electronic component: * **Base Material:** Aluminum Alloy (Lightweight yet durable). * **Plating:** Cadmium over Electroless Nickel. * **Conductivity:** High (Necessary for effective grounding/shielding). * **Operating Temp:** Typically rated for **-65°C to +150°C**. --- ### 4. Typical Applications Because Micro-D connectors are 50% smaller than standard D-Sub connectors, these backshells are found in: * **Avionics:** Flight control systems and cockpit displays. * **Satellites:** Space-constrained internal wiring. * **Medical Equipment:** Portable imaging or diagnostic tools requiring high-density interconnects. * **Military Ground Tech:** Ruggedized communication handsets. ---