数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

  • AISC-0603-R024

  • AI
    The **AISC-0603-R024** is a specific surface-mount electronic component, categorized as a **Wire-Wound Ceramic Chip Inductor**. It is widely used in high-frequency RF (Radio Frequency) circuits due to its high Q-factor and stable performance. ### 1. Part Number Breakdown Understanding the nomenclature helps identify the physical and electrical characteristics: | Part Segment | Meaning | Details | | :--- | :--- | :--- | | **AISC** | Series Name | High-frequency wire-wound chip inductor series | | **0603** | Package Size | 0.06 x 0.03 inches (Metric 1608) | | **R024** | Inductance Value | **24 nH** (Nanohenries) | --- ### 2. Technical Specifications Below are the typical electrical parameters for the 24nH variant of this series: | Parameter | Value | | :--- | :--- | | **Inductance** | 24 nH | | **Tolerance** | Usually ±5% (J) or ±10% (K) | | **Quality Factor (Q) Min** | 35 @ 250MHz | | **Self-Resonant Frequency (SRF)** | ~2650 MHz | | **DC Resistance (DCR) Max** | 0.22 Ω | | **Rated Current (Max)** | 600 mA | | **Operating Temperature** | -40°C to +125°C | --- ### 3. Key Features * **Wire-Wound Construction:** Unlike multilayer inductors, the wire-wound design provides much lower DC resistance and a significantly higher Q-factor. * **Ceramic Core:** Provides excellent thermal stability and high-frequency performance. * **Small Footprint:** The 0603 size is ideal for compact PCB designs in mobile and handheld devices. * **High SRF:** The high self-resonant frequency ensures the part behaves as an inductor deep into the GHz range. --- ### 4. Common Applications These components are typically found in the RF stages of electronic devices: * **Impedance Matching:** Used in antenna circuits to match the impedance of the power amplifier. * **Filtering:** Low-pass, high-pass, or band-pass filters for signal integrity. * **Oscillators:** Used in VCOs (Voltage Controlled Oscillators) for frequency stability. * **Wireless Communication:** Common in Bluetooth, Wi-Fi, and LTE modules. --- ### 5. Land Pattern (Suggested Footprint) When designing a PCB for this part, use the following standard 0603 dimensions (in mm): ```text [ Pad ] [ Pad ] +-----+ +-----+ | 1.0 | < L > | 1.0 | +-----+ +-----+ <--- 1.92 mm ---> (Total Length) ```
    ✨ Follow-up Questions
    • What is the difference between a wire-wound inductor and a multilayer inductor?
    • How does the Q-factor affect RF circuit performance?
    • Can I substitute a 24nH inductor with a different value in an impedance matching circuit?