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  • AM25LS2520FCB

  • AI
    The **AM25LS2520FCB** is a high-performance, low-power Schottky (LS) integrated circuit, specifically categorized as an **8-bit Octal Register** with three-state outputs. It is part of the Advanced Micro Devices (AMD) 25LS series, designed for high-speed microprocessor and bus-oriented systems. --- ### 1. Key Technical Specifications | Parameter | Value / Description | | :--- | :--- | | **Logic Family** | Low-Power Schottky (LS) | | **Function** | Octal D-Type Register (with Clock Enable) | | **Bit Width** | 8-Bit | | **Output Type** | 3-State (Tri-state) | | **Package Type** | FCB (Flatpack, Ceramic Bottom) | | **Supply Voltage ($V_{CC}$)** | 5.0V Typ (4.75V to 5.25V) | | **Operating Temperature** | -55°C to +125°C (Military Grade) | --- ### 2. Functional Description The device consists of eight edge-triggered D-type flip-flops. It is unique because it includes specialized control pins that make it highly efficient for data bus buffering. #### Core Components: * **Clock ($CP$):** Data is loaded into the registers on the low-to-high (positive) transition of the clock. * **Clock Enable ($\overline{EN}$):** When low, it allows the clock to trigger the flip-flops. When high, the registers retain their current state regardless of the clock signal. * **Output Enable ($\overline{OE}$):** Controls the 3-state outputs. When $\overline{OE}$ is low, the data in the registers is present on the output pins. When high, the outputs are in a high-impedance state (disconnected). * **Clear ($\overline{CLR}$):** A low signal on this pin asynchronously resets all internal flip-flops to a logic low state. --- ### 3. Pinout Configuration (Standard 22-24 Pin) While the exact physical layout depends on the Ceramic Flatpack (FCB) dimensions, the logical mapping generally follows this structure: | Pin Category | Description | | :--- | :--- | | **$D_0 - D_7$** | Data Inputs (8 bits) | | **$Q_0 - Q_7$** | Data Outputs (8 bits) | | **$CP$** | Clock Pulse Input | | **$\overline{EN}$** | Clock Enable (Active Low) | | **$\overline{OE}$** | Output Enable (Active Low) | | **$\overline{CLR}$** | Clear/Reset (Active Low) | | **$V_{CC} / GND$** | Power and Ground | --- ### 4. Applications Due to the **FCB (Ceramic Flatpack)** packaging, this specific part is usually intended for high-reliability environments: 1. **Military & Aerospace:** The ceramic housing and wide temperature range make it suitable for flight controllers and defense systems. 2. **Bus-Oriented Storage:** Used as an intermediate buffer between a CPU and a data bus. 3. **Digital Signal Pipelines:** Acts as a synchronized "waiting room" for 8-bit data packets. --- ### 5. Logic Behavior Table ```text Inputs | Internal | Output CLR EN CP D | Q | Y --------------------|----------|------- L X X X | L | L (if OE=L) H L ↑ H | H | H (if OE=L) H L ↑ L | L | L (if OE=L) H H X X | No Change| Q-Latched X X X X | X | Hi-Z (if OE=H) ```
    ✨ Follow-up Questions
    • What are the primary differences between the LS and the standard TTL versions of this chip?
    • How does the 'FCB' package impact thermal management compared to plastic DIP?
    • What is the typical propagation delay for the AM25LS2520?