The **ASPI-6045S-R82** is a surface-mount (SMD) power inductor manufactured by **Abracon**. It belongs to the ASPI-6045S series, which is characterized by its shielded construction and high-power efficiency in a compact footprint. ### 1. General Specifications The part number follows a specific nomenclature that defines its physical and electrical characteristics. | Parameter | Specification | | :--- | :--- | | **Inductance** | 0.82 µH | | **Tolerance** | ±30% (standard for low inductance values) | | **DC Resistance (DCR)** | ~12 mΩ (Typical) | | **Saturation Current (Isat)** | ~8.00 A | | **Temperature Rise Current (Irms)** | ~5.00 A | | **Case Dimensions** | 6.0 x 6.0 x 4.5 mm | --- ### 2. Key Features * **Magnetic Shielding:** The "S" suffix often denotes a resin-shielded construction. This reduces Electromagnetic Interference (EMI) and prevents the magnetic field from interfering with neighboring components. * **High Power Density:** Designed to handle high saturation currents relative to its small 6x6mm footprint. * **Low Profile:** With a height of 4.5mm, it is suitable for high-density PCB layouts. * **Operating Temperature:** Typically rated for **-40°C to +125°C**, making it robust for industrial applications. --- ### 3. Internal Construction and Materials The inductor is built using a wire-wound method around a ferrite core. * **Core Material:** Ferrite (Ni-Zn or Mn-Zn) for high permeability and low losses at high frequencies. * **Winding:** Copper wire with a high-temperature insulation coating. * **Termination:** Lead-free (Sn) plating over a silver (Ag) or copper (Cu) base, making it RoHS compliant and compatible with standard reflow soldering. --- ### 4. Typical Applications The ASPI-6045S-R82 is primarily used in power management circuits where high efficiency and low EMI are required: * **DC/DC Converters:** Used in Buck (Step-down) and Boost (Step-up) regulators. * **Consumer Electronics:** Power supplies for laptops, tablets, and gaming consoles. * **Telecommunications:** Distributed power systems and base station modules. * **LED Drivers:** Providing stable current for lighting applications. --- ### 5. Soldering Profile This component is designed for SMD mounting. Below is a generic representation of the reflow requirements: ```markdown Reflow Stages: 1. Preheat: 150°C to 200°C (60-120 seconds) 2. Ramp-up: 3°C/second max 3. Peak Temperature: 260°C (10 seconds max) 4. Cooling: 6°C/second max ```