The **ATS-01B-151-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICE" series, designed for cooling electronic components like CPUs, GPUs, and other high-heat-generating semiconductor devices. --- ### 1. Technical Specifications The part follows a specific nomenclature provided by ATS. Below are the core technical details: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ HS | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Thermal Resistance** | 3.93°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | --- ### 2. Physical Design Elements The "electronic" functionality of this part is purely passive, but its geometry is critical for heat dissipation: 1. **Fin Type:** It features a **Straight Fin** design, which is optimized for airflow in a single direction. 2. **Base Material:** High-grade aluminum provides excellent thermal conductivity while remaining lightweight. 3. **Interface:** This part is typically used with a **Thermal Interface Material (TIM)**, such as thermal grease or a pad, to bridge the gap between the electronic component (chip) and the metal base. 4. **Attachment Mechanism:** The `pushPIN™` system utilizes a spring-loaded pin that passes through pre-drilled holes in the PCB. This ensures consistent pressure against the chip for maximum heat transfer. --- ### 3. Thermal Performance Comparison Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 3.93 | | 300 (1.5 m/s) | 2.15 | | 500 (2.5 m/s) | 1.74 | | 700 (3.5 m/s) | 1.51 | --- ### 4. Integration Logic The part number suffix **C2** indicates the specific spring and pin material: * **C2:** Refers to a specific tension spring and plastic push-pin assembly. * **R0:** Refers to the RoHS compliance status and revision level of the design.