The **ATS-01B-154-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICE" series, designed primarily for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 7.58 °C/W (at 200 LFM) | | **Flow Orientation** | Vertical/Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Elements #### A. Fin Design The part utilizes **Straight Fins**, which are optimized for unidirectional airflow. This design provides a large surface area for heat dissipation while maintaining a relatively low profile (15mm), making it suitable for compact electronic enclosures. #### B. The pushPIN™ Attachment System One of the defining "electronic part" features is the mounting mechanism: * **Precision Springs:** Ensures consistent pressure across the component (TIM) for maximum heat transfer. * **Engagement:** The "pushPIN" design allows for quick and secure attachment to the PCB through pre-drilled holes, preventing the heat sink from shifting during vibration or shipping. #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** Beyond aesthetics, the anodized layer provides electrical insulation and improves corrosion resistance, ensuring the part does not short-circuit nearby components if incidental contact occurs. --- ### 3. Thermal Performance Analysis The efficiency of the ATS-01B-154-C2-R0 is highly dependent on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (200 LFM)** | 7.58 | | **Ducted (400 LFM)** | 4.01 | | **Ducted (600 LFM)** | 3.20 | --- ### 4. Typical Applications This component is commonly found in: * **Telecommunications:** Cooling networking switches and routers. * **Industrial PC (IPC):** Managing thermals for embedded processors. * **Power Supplies:** Heat dissipation for MOSFETs and power regulators.