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  • ATS-01B-159-C1-R0

  • AI
    The **ATS-01B-159-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Black Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions** | 45mm x 45mm x 10mm | | **Thermal Resistance** | 20.90°C/W (Unducted Flow @ 200 LFM) | | **Airflow Path** | Straight Fin | --- ### 2. Electronic Application & Usage This part is categorized as a **passive cooling** component. In the context of an electronic circuit, its role is defined by the following parameters: * **Thermal Management:** It increases the surface area of a semiconductor package, allowing heat to transfer more efficiently into the surrounding air. * **Thermal Interface Material (TIM):** This specific model typically comes with **ATS-PPS-01** (pre-applied Phase Change Material) or similar thermal tape to ensure there are no air gaps between the chip and the aluminum base. * **Mechanical Security:** The "Push-Pin" system provides a consistent "Force-on-Chip," ensuring the heat sink stays mounted even under mechanical vibration or shock. --- ### 3. Component Breakdown #### A. The Fin Design The **Straight Fin** geometry is optimized for "ducted" or "undirected" airflow. Because the fins are 10mm tall (low profile), it is ideal for 1U servers or compact PCB layouts where vertical space is limited. #### B. Material Properties * **Aluminum 6063:** Provides a balance between high thermal conductivity and structural integrity. * **Black Anodization:** Aside from aesthetics, the black coating slightly increases the **emissivity** of the surface, aiding in heat dissipation through radiation. #### C. Mounting Mechanism The part number suffix (`-R0`) indicates the specific revision and mounting hardware. The push-pins are designed to fit into standard hole patterns (typically 3.0mm holes) on a PCB, eliminating the need for messy adhesives. --- ### 4. Part Number Decoder (ATS Standard) | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **01** | Series Type | | **B** | Attachment Style (Push-Pin) | | **159** | Product Identifier (Base dimensions/Fin count) | | **C1** | Thermal Interface Material Code | | **R0** | RoHS Compliant / Revision Number |
    ✨ Follow-up Questions
    • What is the hole-to-hole spacing required on a PCB for this heat sink?
    • Can this heat sink be used with a 12V DC fan for active cooling?
    • What is the maximum operating temperature for the pre-applied thermal interface material?