The **ATS-01F-82-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its electronic and mechanical specifications. --- ### 1. Technical Specifications This part is designed for "Push-Pin" mounting, providing a secure and consistent pressure for thermal interface materials. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 10.92°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 30mm x 30mm x 25mm | | **Weight** | 35 grams | --- ### 2. Key Design Features #### A. Fin Pattern (Square-Cut) The "82" in the part number refers to the specific fin geometry. This heat sink uses a **cross-cut** or **pin-fin** style design. * **Omnidirectional Airflow:** Unlike straight-fin heat sinks, this design allows air to enter from any direction, making it ideal for systems with complex or turbulent internal airflow. * **Increased Surface Area:** The gaps between the squares maximize the cooling surface area relative to the footprint. #### B. Mounting Mechanism (Push-Pin) The "R0" designation refers to the attachment kit. * **Compression Springs:** The plastic push-pins are equipped with springs that provide precise vertical pressure (Pre-load) to the Integrated Circuit (IC). * **Reliability:** This prevents the heat sink from shifting during vibration or shipping, which is a common failure point for "stick-on" adhesive heat sinks. #### C. Thermal Interface Material (TIM) * The part usually comes pre-applied with **T412** thermal tape or a high-performance thermal pad. This ensures there are no microscopic air gaps between the chip and the aluminum base. --- ### 3. Application Use Cases This specific size (30mm x 30mm) is commonly used for: 1. **BGA Packages:** High-speed Field Programmable Gate Arrays (FPGAs) and ASICs. 2. **Network Switch Chips:** Cooling processors in routers and switches. 3. **Embedded Systems:** Industrial PCs where active fan cooling is not feasible and passive convection is required. --- ### 4. Part Number Decoder Understanding the "ATS-01F-82-C3-R0" nomenclature: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **01F** | Series/Product Family | | **82** | Fin Design/Geometry | | **C3** | Thermal Interface Material / Color (Blue Anodized) | | **R0** | Revision / Packaging Type |