The **ATS-01F-84-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and PCBs. --- ### 1. Technical Specifications The following table highlights the key physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 30.00mm x 30.00mm x 35.00mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 7.00°C/W (at 100 LFM) | | **Weight** | 35.0 grams | --- ### 2. Key Component Features #### A. The pushPIN™ Attachment System Unlike traditional adhesive-based heat sinks, the **R0** suffix indicates a push-pin mounting mechanism. * **Spring-Loaded:** Provides a consistent "Force-to-Board" ratio, ensuring optimal contact between the heat sink and the component. * **Reliability:** Resistant to vibration and mechanical shock compared to thermal tape. #### B. Thermal Performance The "35mm" height (the "C2" designator in the part number sequence) provides a larger surface area for heat dissipation. * **Airflow Optimization:** Designed for use in forced convection environments. * **Resistance Curve:** While it performs at 7.00°C/W at low air speeds, it can reach as low as **1.5°C/W** in high-velocity (800 LFM) airflow environments. #### C. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and light weight. * **Blue Anodization:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and electrical insulation to the surface. --- ### 3. Comparison with Similar Models | Part Number | Height | Thermal Resistance (100 LFM) | Attachment | | :--- | :--- | :--- | :--- | | ATS-01F-83-C2-R0 | 30.00mm | 8.57°C/W | pushPIN™ | | **ATS-01F-84-C2-R0** | **35.00mm** | **7.00°C/W** | **pushPIN™** | | ATS-01F-85-C2-R0 | 40.00mm | 6.20°C/W | pushPIN™ | --- ### 4. Typical Applications * **CPU/GPU Cooling:** Small form factor processors. * **Power Modules:** Transistors and MOSFETs in power supplies. * **Telecommunications:** High-speed data processing chips on network switches.