The **ATS-01F-85-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The following table summarizes the primary physical and thermal properties of this specific model: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 10mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 24.11 °C/W @ 100 LFM | --- ## 2. Key Component Features ### A. Material & Surface Treatment * **Aluminum 6063:** This alloy provides an excellent balance between thermal conductivity and structural rigidity. * **Blue Anodized Finish:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly improves radiant heat transfer. ### B. pushPIN™ Attachment System The "85" in the part number indicates a specific hardware configuration. This system features: * **Brass Push Pins:** Durable pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These ensure consistent pressure (clamping force) between the heat sink and the electronic component, which is vital for maximizing thermal transfer through the Thermal Interface Material (TIM). ### C. Thermal Performance The efficiency of this part is measured by its thermal resistance (lower is better). In a low-airflow environment (100 Linear Feet per Minute), it provides a resistance of **24.11 °C/W**. As airflow increases to 700 LFM, the resistance drops significantly to approximately **2.47 °C/W**. --- ## 3. Dimensions Detail * **Base Length:** 35.00 mm * **Base Width:** 35.00 mm * **Height (Fin Height):** 10.00 mm * **Pitch (Hole Spacing):** 40.00 mm (center-to-center for mounting) --- ## 4. Typical Applications This part is commonly found in: 1. **Telecommunications:** Networking switches and routers. 2. **Industrial PCs:** Small form factor boards requiring passive or forced-air cooling. 3. **Embedded Systems:** Cooling specialized microcontrollers or power management ICs.