The **ATS-01F-86-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It belongs to the *maxiFLOW™* product line, designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | Push-Pin (Plastic) with Brass Springs | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Thermal Resistance** | 3.29 °C/W @ 200 LFM | | **Thermal Interface (TIM)** | T412 (High performance) | | **Fin Style** | Straight Fin / maxiFLOW™ | --- ### 2. Key Electronic Parts & Components The assembly is composed of several critical sub-parts that ensure efficient operation: #### A. The Heat Sink Body (Aluminum) The core "electronic part" is the extruded aluminum body. It uses a **maxiFLOW™** design, which features a flared fin geometry. This increases the surface area for convection while maintaining a low pressure drop, allowing air to flow through more effectively. #### B. The Thermal Interface Material (TIM) * **Part ID:** T412 * **Function:** This is a pre-applied phase-change material or thermal pad on the base of the heat sink. It fills microscopic air gaps between the electronic component (the chip) and the heat sink base to maximize heat transfer. #### C. Mounting Hardware (Push-Pins and Springs) * **Push-Pins:** Made of durable plastic (typically nylon), designed to fit into 3.00mm holes on a PCB. * **Compression Springs:** These are calibrated brass springs that provide a specific "down-force" (clamping pressure). This pressure ensures the TIM is compressed correctly against the chip without damaging the silicon or the solder balls. --- ### 3. Application Context The ATS-01F-86-C3-R0 is typically used in environments where **forced air cooling** (fans) is present. It is ideal for: * **Telecommunications:** Network switches and routers. * **Computing:** Embedded systems and industrial PCs. * **Power Electronics:** Voltage regulators and high-speed memory modules. ---