The **ATS-01F-87-C3-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Blue Anodized Aluminum | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 12.70mm | | **Thermal Resistance (Flowing Air)** | 2.70°C/W @ 200 LFM | | **Thermal Resistance (Still Air)** | 6.67°C/W | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight (maxiFLOW™ Tapered) | | **Compliance** | RoHS Compliant | --- ### 2. Core Electronic Components & Features #### A. The maxiFLOW™ Design Unlike standard square-cut heat sinks, the **ATS-01F-87-C3-R0** features a tapered fin structure. This design increases the surface area while reducing the pressure drop across the heat sink. This is critical for high-density electronic assemblies where airflow might be restricted. #### B. pushPIN™ Attachment System This part uses a specific mechanical fastening system: * **Compression Springs:** Provides high "Force-to-Load" to ensure the heat sink makes consistent contact with the electronic component. * **Plastic/Brass Pins:** Securely locks the heat sink into pre-drilled holes in the PCB. * **Ease of Assembly:** Allows for repeatable, tool-free installation in production environments. #### C. Thermal Interface Material (TIM) The "R0" suffix typically denotes the pre-applied thermal material. In this series, it usually comes with **T766** high-performance thermal phase-change material or tape, which fills microscopic air gaps between the component and the heat sink base to maximize heat transfer. --- ### 3. Application Use-Cases This heat sink is typically found in the following electronic sectors: 1. **Telecommunications:** Cooling networking chips in routers and switches. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. 3. **Power Supplies:** Heat dissipation for high-voltage regulators. ---