ATS-01F-88-C2-R0
AI

The **ATS-01F-88-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing the cooling element directly to a Printed Circuit Board (PCB).
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (L x W)** | 35mm x 35mm |
| **Height** | 17.78mm |
| **Attachment Type** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 6.67°C/W (at 100 LFM) |
| **Fin Style** | Straight Fin |
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### 2. Key Electronic Components & Design
The "Electronic Parts" involved in this assembly are not active circuits, but rather mechanical-electronic interfacing components:
* **The Heat Sink Body:** Extruded aluminum designed with high-density fins to maximize surface area for heat dissipation from electronic components like BGA chips, FPGAs, or CPUs.
* **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses brass push-pins that click into pre-drilled holes on the PCB. This ensures a consistent downward pressure (clamping force) on the semiconductor.
* **Compression Springs:** These provide the necessary tension to maintain a tight seal between the heat sink and the electronic chip, preventing gaps that cause overheating.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the chip and the heat sink.
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### 3. Application Use Cases
This part is commonly found in the following electronic environments:
1. **Telecommunications:** Cooling of networking processors.
2. **Embedded Systems:** Thermal regulation for industrial PC components.
3. **Power Electronics:** Managing heat in high-efficiency power supplies.
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### 4. Part Number Breakdown
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **01F:** Series designation.
* **88:** Specific fin geometry and size code.
* **C2:** Material/Finish (Aluminum / Blue Anodized).
* **R0:** RoHS Compliance/Revision status.
- ⤷
What are the PCB hole requirements for the push-pin mounting system?
- ⤷ How does the thermal resistance change at higher airflow (LFM)?
- ⤷ Can the pre-applied T766 thermal material be replaced with standard thermal paste?