ATS-02D-159-C1-R0
AI

The **ATS-02D-159-C1-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*, specifically part of the **push-pin** attachment series. It is designed for cooling electronic components such as CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Type** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 2.07°C/W (@ 200 LFM) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm |
| **Fin Style** | Straight Fin |
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### 2. Key Electronic Features
#### A. Thermal Interface Material (TIM)
This specific model comes pre-applied with **ATS-PPS-10**. The TIM is critical in electronics to fill microscopic air gaps between the heat sink and the component surface, significantly improving heat transfer efficiency.
#### B. Aerodynamic Fin Design
The straight-fin pattern is optimized for **forced air cooling** (active airflow from fans). The 10mm low-profile height makes it suitable for tight electronic enclosures or rack-mounted systems where vertical space is limited.
#### C. Secure Attachment Mechanism
Unlike adhesive-based heat sinks, the "Push-Pin" system provides:
* **Constant Pressure:** Ensures consistent contact with the electronic chip.
* **Vibration Resistance:** Ideal for industrial electronics or automotive applications.
* **Reliability:** Brass pins and steel springs are more durable over long-term thermal cycling than thermal tape.
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### 3. Part Number Breakdown
Understanding the nomenclature helps in identifying its electronic application:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **02** | Attachment Hole Pattern / Series |
| **159** | Specific size/dimension profile |
| **C1** | Material/Finish Code (Blue Anodized Aluminum) |
| **R0** | Revision or Packaging code |
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- ⤷
What are the mounting hole requirements for the ATS-02D-159-C1-R0?
- ⤷ How does the thermal resistance change at different airflow speeds (LFM)?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied TIM?