The **ATS-02D-187-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 10.69°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components Features ### A. Material and Thermal Dissipation The unit is made from **Aluminum 6063**, which offers a high strength-to-weight ratio and excellent thermal conductivity. The **Blue Anodized** finish is not just aesthetic; it provides surface protection and slightly increases emissivity, aiding in heat radiation. ### B. Attachment Mechanism Instead of messy adhesives or difficult soldering, this part uses a **Brass Push-Pin** system: * **Reliability:** Ensures consistent pressure across the surface of the electronic chip. * **Safety:** The plastic or metal push-pins are designed to fit into pre-drilled holes (usually 3.0mm) on the PCB, preventing the heat sink from shifting during vibration. ### C. Thermal Interface Material (TIM) The "C1" in the part number indicates the inclusion of **T766 thermal grease**. This is a critical "electronic part" of the assembly because it fills the microscopic air gaps between the component die and the heat sink base, significantly reducing thermal impedance. --- ### 3. Thermal Performance Profile The effectiveness of this heat sink depends on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure. | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.69 | | 300 (1.5 m/s) | 3.52 | | 500 (2.5 m/s) | 2.50 | --- ### 4. Typical Applications * **Northbridge/Southbridge** chips on motherboards. * **FPGA** (Field Programmable Gate Arrays) cooling. * **Telecommunications** equipment where space (10mm height) is restricted. * **Industrial PCs** subject to high-vibration environments.