The **ATS-02E-111-C3-R1** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" thermal management series designed to provide efficient cooling for electronic components like CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 26.82 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 10.00mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Key Electronic Components While the heat sink itself is a mechanical component, it is defined by its interaction with electronic systems: * **Heat Sink Body:** Extruded aluminum with a "Fine Pitch" fin design. This maximizes surface area to dissipate heat generated by semiconductors into the surrounding air. * **Push-Pin Mounting:** Uses a spring-loaded mechanism (available in plastic or brass) that ensures constant pressure on the electronic chip. This pressure is vital for minimizing the thermal gap between the chip and the sink. * **Thermal Interface Material (TIM):** The part comes with **T412**, a high-performance thermal pad or grease pre-applied to the base. This fills microscopic air gaps between the heat sink and the electronic component (e.g., an FPGA or ASIC) to improve heat transfer. --- ### 3. Application Use Cases This specific model is typically used in the following electronic environments: 1. **Telecommunications:** Cooling high-speed data processing chips in routers and switches. 2. **Embedded Systems:** Small form-factor industrial PCs where vertical space (10mm height) is limited. 3. **Power Electronics:** Dissipating heat from Voltage Regulator Modules (VRMs). --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 26.82 | | 300 | 1.5 | 9.75 | | 500 | 2.5 | 5.92 |