The **ATS-13F-50-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for secure attachment to Printed Circuit Boards (PCBs). --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-13F-50-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 1.88° C/W (@ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Components & Construction #### A. Fin Design (XC Cut) This model features an **XC Cut** (cross-cut) pattern. Unlike straight-fin heat sinks, these "pin-fin" or cross-cut structures allow for multi-directional airflow. This makes it highly efficient in crowded electronic enclosures where airflow may not be perfectly linear. #### B. Push-Pin Attachment Mechanism Instead of using messy thermal glues or heavy brackets, this part uses a **Brass Push-Pin**. - **The Spring:** A stainless steel spring provides consistent pressure (load) on the component, ensuring maximum contact with the heat source. - **The Pin:** The brass pin snaps into pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. - This is a "phase-change" or high-performance pad that fills microscopic air gaps between the chip (CPU/GPU/FPGA) and the aluminum base. - It eliminates the need for manual application of thermal paste. --- ### 3. Electronic Application This heat sink is typically used to cool medium-sized electronic components that generate significant heat during operation, such as: * **FPGAs & ASICs:** Used in networking gear or signal processing. * **Processors:** Low-power CPUs or embedded controllers. * **Power Converters:** High-density DC-DC converters. --- ### 4. Thermal Performance Comparison *Performance is measured by how many degrees Celsius the temperature rises per Watt of power.* | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Low flow) | 1.88 | | 300 (Medium flow) | 1.05 | | 500 (High flow) | 0.85 | ---