数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

  • ATS-21E-14-C1-R0

  • AI
    The **ATS-21E-14-C1-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW" series, known for its unique flared fin geometry. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-21E-14-C1-R0 | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ | | **Fin Style** | maxiFLOW (Flared Fins) | | **Dimensions (L x W x H)** | 52.45mm x 52.45mm x 12.70mm | | **Thermal Resistance** | 0.99 °C/W (@ 200 LFM) | --- ### 2. Key Electronic & Design Features #### A. Flared Fin Design (maxiFLOW) The "maxiFLOW" geometry is engineered to maximize surface area while maintaining a low profile. The flared fins improve airflow ingestion and reduce the pressure drop, which is critical in densely packed electronic enclosures where airflow might be limited. #### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or fragile clips, this part utilizes a **pushPIN™** mechanism: * **Compression Springs:** Provides precise, uniform pressure across the component (CPU/GPU/ASIC) to ensure optimal thermal interface contact. * **Secure Fit:** Prevents the heatsink from shifting during mechanical shock or vibration. #### C. Thermal Performance With a thermal resistance of **0.99 °C/W** at 200 LFM (Linear Feet per Minute), this part is capable of dissipating significant heat loads, making it suitable for high-speed processors and power electronics. --- ### 3. Application Use Cases This component is typically found in the following electronic environments: 1. **Telecommunications:** Cooling for high-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling for Voltage Regulator Modules (VRMs) and MOSFETs. 4. **Networking:** Server blades and data center equipment. --- ### 4. Part Number Breakdown The suffix code provides information on the material and finish: * **C1:** Refers to the thermal interface material (TIM) or specific coating. * **R0:** Indicates the revision and standard packaging/compliance (RoHS compliant).
    ✨ Follow-up Questions
    • What is the significance of the blue anodized finish on this heatsink?
    • Can the pushPIN attachment be used on any PCB layout?
    • How does the flared fin design compare to straight fin heatsinks?