ATS-21E-142-C3-R0
AI

The **ATS-21E-142-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "push-pin" series designed for secure attachment to Printed Circuit Boards (PCBs).
### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 12.33°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm |
| **Thermal Interface Material (TIM)** | T412 (Pre-applied) |
---
### 2. Key Components & Design
The part is engineered to dissipate heat from surface-mount devices (SMDs) such as BGA chips, FPGAs, or processors.
* **Fins (Cross-Cut Design):** The "142" series features a cross-cut fin pattern. This allows for multi-directional airflow, making it efficient regardless of the orientation of the cooling fans.
* **Push-Pin Attachment:** Unlike adhesive tapes, the brass push-pins provide a mechanical lock into pre-drilled holes in the PCB. This ensures a consistent downward pressure (clamping force) for optimal heat transfer.
* **Thermal Interface Material (T412):** This is a high-performance "phase change" or conductive pad pre-applied to the base. It fills microscopic air gaps between the heat sink and the electronic component.
---
### 3. Part Number Breakdown
Understanding the nomenclature helps in identifying variants:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer Prefix (Advanced Thermal Solutions) |
| **21E** | Series Identifier (Push-Pin Series) |
| **142** | Specific Fin Layout and Dimension Code |
| **C3** | Finish Code (Blue Anodized) |
| **R0** | Revision/Packaging Standard |
---
### 4. Implementation Example
To use this part in a hardware design, the PCB layout must account for the specific hole pattern for the push-pins.
```markdown
# Layout Requirements
1. Hole Diameter: 3.00mm (typical for ATS brass pins)
2. Hole Spacing: 24.00mm (center-to-center)
3. Keep-out Zone: 32mm x 32mm (to avoid component interference)
```
- ⤷
What are the airflow requirements to achieve optimal thermal resistance for this heat sink?
- ⤷ Can the T412 thermal interface material be replaced with standard thermal paste?
- ⤷ What is the specific hole pattern dimensions required on the PCB for the ATS-21E series?