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  • ATS-21E-142-C3-R0

  • AI
    The **ATS-21E-142-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "push-pin" series designed for secure attachment to Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 12.33°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Key Components & Design The part is engineered to dissipate heat from surface-mount devices (SMDs) such as BGA chips, FPGAs, or processors. * **Fins (Cross-Cut Design):** The "142" series features a cross-cut fin pattern. This allows for multi-directional airflow, making it efficient regardless of the orientation of the cooling fans. * **Push-Pin Attachment:** Unlike adhesive tapes, the brass push-pins provide a mechanical lock into pre-drilled holes in the PCB. This ensures a consistent downward pressure (clamping force) for optimal heat transfer. * **Thermal Interface Material (T412):** This is a high-performance "phase change" or conductive pad pre-applied to the base. It fills microscopic air gaps between the heat sink and the electronic component. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer Prefix (Advanced Thermal Solutions) | | **21E** | Series Identifier (Push-Pin Series) | | **142** | Specific Fin Layout and Dimension Code | | **C3** | Finish Code (Blue Anodized) | | **R0** | Revision/Packaging Standard | --- ### 4. Implementation Example To use this part in a hardware design, the PCB layout must account for the specific hole pattern for the push-pins. ```markdown # Layout Requirements 1. Hole Diameter: 3.00mm (typical for ATS brass pins) 2. Hole Spacing: 24.00mm (center-to-center) 3. Keep-out Zone: 32mm x 32mm (to avoid component interference) ```
    ✨ Follow-up Questions
    • What are the airflow requirements to achieve optimal thermal resistance for this heat sink?
    • Can the T412 thermal interface material be replaced with standard thermal paste?
    • What is the specific hole pattern dimensions required on the PCB for the ATS-21E series?