The **ATS-51170D-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power ASICs to prevent thermal throttling or hardware failure. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Part Number** | ATS-51170D-C2-R0 | | **Heat Sink Type** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 17mm x 17mm x 9.5mm | | **Material** | Aluminum (Black Anodized) | | **Thermal Resistance** | ~14.20 °C/W (at 200 LFM) | | **Fin Style** | Tapered (High Performance) | --- ### 2. Core Components and Technologies #### A. maxiFLOW™ Design The heat sink utilizes the **maxiFLOW™** geometry, which features a flared fin structure. This design: * Reduces pressure drop. * Maximizes surface area for convective heat transfer. * Increases airflow efficiency through the fin field. #### B. pushPIN™ Attachment System Rather than using messy adhesives or thermal tape, this part uses the **pushPIN™** system. This involves: * **Compression Springs:** Ensures consistent pressure across the interface for optimal thermal contact. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "C2" in the part number often indicates the type of pre-applied thermal material. In this series, it typically comes with **ATS-527**, a high-performance thermal pad or grease that fills microscopic air gaps between the component and the heat sink base. --- ### 3. Application Use Cases This specific part is typically found in: 1. **Telecommunications:** Networking switches and routers where space is tight but heat density is high. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Small voltage regulators and DC-DC converters. --- ### 4. Mounting Hole Configuration To integrate this into a PCB design, the following hole specifications are generally required: ```markdown - Hole Diameter: 3.12mm (0.123") - Pitch (Spacing): Depends on specific model layout, usually centered around the 17mm footprint. ```