The **ATS-61400W-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for the cooling of high-power electronic components such as CPUs, GPUs, and high-wattage ASICs. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 24.5mm | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | ~1.60 °C/W (at 200 LFM) | | **RoHS Status** | Compliant | --- ### 2. Core Electronic/Thermal Features #### A. maxiFLOW™ Fin Geometry The "W" in the part number signifies the **maxiFLOW™** design. Unlike standard straight-fin heat sinks, this design features a spread-fin pattern that: * Reduces pressure drop. * Increases the surface area for convective heat transfer. * Optimizes airflow from multiple directions. #### B. maxiGRIP™ Attachment System This is a critical electronic hardware feature. Instead of using permanent thermal epoxy or drilling holes in the PCB, it uses a **steady-force clip system**: * **Plastic Frame Clip:** Replaces the need for holes in the PCB. * **Stainless Steel Spring Clip:** Applies consistent pressure across the interface (TIM), ensuring maximum thermal conductivity without damaging the delicate die of the electronic chip. #### C. Thermal Interface Material (TIM) The "R0" designation typically refers to the specific thermal pad or interface material pre-applied to the base. This ensures that micro-gaps between the electronic component and the metal heat sink are filled, reducing thermal impedance. --- ### 3. Application Use Cases This part is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed processing chips in routers and switches. 2. **Embedded Systems:** Thermal management for industrial PC components. 3. **Power Electronics:** Dissipating heat from high-density power modules.