CE201210-R27J
AI

The **CE201210-R27J** is a surface-mount multilayer ceramic chip inductor. It is commonly used in high-frequency circuits for filtering, impedance matching, and decoupling.
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## 1. Part Number Breakdown
The part number follows a standard nomenclature used by manufacturers (like Bourns or similar) to define physical and electrical characteristics.
| Segment | Meaning | Details |
| :--- | :--- | :--- |
| **CE** | Product Series | Multilayer Chip Inductor (Ceramic Type) |
| **201210** | Case Size (EIA) | 2.0mm x 1.25mm x 1.0mm (0805 Imperial) |
| **R27** | Inductance Value | R denotes decimal; 0.27 µH (270 nH) |
| **J** | Tolerance | ±5% |
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## 2. Technical Specifications
These parts are designed for high-density mounting and provide stable electrical characteristics across a wide frequency range.
* **Inductance:** 0.27 µH (270 nH)
* **Tolerance:** ±5%
* **Q Factor:** Typically high (usually >25 at 25MHz) to ensure low signal loss.
* **Self-Resonant Frequency (SRF):** High SRF (typically >400 MHz), making it suitable for RF applications.
* **DCR (DC Resistance):** Low resistance to minimize power loss and heat generation.
* **Rated Current:** Usually ranges between 150mA to 300mA depending on the specific manufacturer series.
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## 3. Physical Dimensions (0805 Package)
The "201210" code translates to the following dimensions:
| Dimension | Metric (mm) | Tolerance |
| :--- | :--- | :--- |
| **Length (L)** | 2.00 mm | ± 0.2 mm |
| **Width (W)** | 1.25 mm | ± 0.2 mm |
| **Thickness (T)** | 1.00 mm | ± 0.2 mm |
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## 4. Key Applications
Because this is a multilayer ceramic inductor rather than a wire-wound type, it offers excellent electromagnetic shielding and high reliability.
* **RF Modules:** Used in Bluetooth, Wi-Fi, and cellular front-end modules.
* **EMI Suppression:** Filtering high-frequency noise in digital signal lines.
* **Impedance Matching:** Ensuring maximum power transfer between stages in RF amplifiers.
* **Mobile Devices:** Ideal for smartphones and tablets due to the small 0805 footprint.
- ⤷
What is the difference between a multilayer ceramic inductor and a wire-wound inductor?
- ⤷ How does the 'Q factor' affect the performance of this inductor in an RF circuit?
- ⤷ Are there specific soldering temperature profiles recommended for the 0805 package?