The **CS321613-R82K** is a surface-mount (SMD) multilayer chip inductor. It is commonly used in high-frequency circuits for noise filtering, signal conditioning, and impedance matching. Below is a detailed breakdown of its specifications and characteristics based on its nomenclature and electronic properties. ### 1. Part Number Breakdown The part number follows a standard convention used by manufacturers like **Bourns** or **Chilisin**: | Segment | Meaning | Description | | :--- | :--- | :--- | | **CS** | Product Series | Chip Inductor (Standard/Multilayer) | | **3216** | Dimensions (Metric) | 3.2mm x 1.6mm (EIA **1206** size) | | **13** | Thickness/Profile | Typically 1.1mm to 1.3mm height | | **R82** | Inductance Value | **0.82 µH** (R denotes decimal point) | | **K** | Tolerance | **±10%** | --- ### 2. Technical Specifications Multilayer inductors are constructed by layering ceramic materials and screen-printed conductive patterns, resulting in a monolithic structure that is highly reliable. | Parameter | Typical Value | | :--- | :--- | | **Inductance** | 0.82 µH | | **Tolerance** | ±10% | | **Case Size** | 1206 (3216 Metric) | | **DC Resistance (DCR)** | ~0.30 - 0.60 Ω (Approximate) | | **Rated Current** | ~100mA - 300mA | | **Self-Resonant Frequency (SRF)** | >80 MHz | | **Operating Temperature** | -55°C to +125°C | --- ### 3. Key Characteristics * **Magnetic Shielding:** Due to the multilayer construction, the magnetic flux is contained within the body, reducing EMI (Electromagnetic Interference) and cross-talk between components. * **Miniaturization:** The 1206 footprint allows for high-density PCB mounting. * **High Reliability:** The monolithic structure provides excellent heat resistance and mechanical strength. * **Material:** Usually made with a Ferrite or Ceramic base depending on the specific frequency target. --- ### 4. Common Applications This specific inductor value (0.82 µH) is frequently found in: * **RF Circuits:** Used for matching networks in wireless communication devices. * **Noise Suppression:** Filtering high-frequency noise in digital signal lines. * **Power Management:** Small DC-DC converters and decoupling for IC power pins. * **Consumer Electronics:** Mobile phones, laptops, and tablets. ---