The **CTIHLP104F-R88M** is a high-current, shielded power inductor typically used in DC-DC converter applications. It belongs to the **CTIHLP** series, known for its low profile and high efficiency. ### 1. Part Number Breakdown Understanding the nomenclature helps identify the component's physical and electrical characteristics: | Code | Meaning | Description | | :--- | :--- | :--- | | **CTIHLP** | Series | High Current Low Profile Inductor | | **104F** | Size Code | Approx. 11.5mm x 10.3mm footprint | | **R88** | Inductance | 0.88 µH (Microhenries) | | **M** | Tolerance | ±20% | --- ### 2. Key Technical Specifications Below are the typical electrical parameters for this specific component: | Parameter | Value | | :--- | :--- | | **Inductance** | 0.88 µH | | **Tolerance** | ±20% | | **DCR (Direct Current Resistance)** | ~3.0 mΩ (Max) | | **Isat (Saturation Current)** | ~25A - 28A (Drop in L ≈ 20-30%) | | **Irms (Rated Current)** | ~18A - 22A (Temp rise ≈ 40°C) | | **Operating Temperature** | -55°C to +125°C | --- ### 3. Core Features & Construction * **Shielded Construction:** The inductor is molded with a magnetic metal powder core. This provides excellent EMI (Electromagnetic Interference) shielding, reducing noise interference with surrounding components. * **Low DCR:** The use of flat wire or heavy gauge copper leads to very low internal resistance, which minimizes power loss through heat. * **Soft Saturation:** Unlike ferrite cores that lose inductance sharply, this composite core material exhibits "soft saturation," meaning it maintains functionality even during high current spikes. * **Lead-Free/RoHS:** Compliant with modern environmental standards for electronics manufacturing. --- ### 4. Typical Applications The CTIHLP104F-R88M is commonly found in power management circuits where high current and small footprints are required: 1. **Voltage Regulator Modules (VRM):** Used in CPUs and GPUs. 2. **DC-DC Converters:** Point-of-Load (POL) power supplies. 3. **Battery Powered Systems:** Handheld devices and laptops where efficiency is critical. 4. **Telecom/Server Hardware:** High-density power boards. --- ### 5. Recommended Footprint (Example) ```pcb // Typical Pad Dimensions for 104F Series Pad Width: 4.5 mm Pad Height: 5.0 mm Gap Between Pads: 5.5 mm ```