数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

  • CTLL2012-R18J

  • AI
    The **CTLL2012-R18J** is a surface-mount (SMD) multilayer chip inductor. It is a passive electronic component designed for high-frequency circuits, typically used in signal conditioning and filtering. --- ### 1. Part Number Breakdown Understanding the nomenclature helps identify the physical and electrical characteristics of the component: | Code Segment | Meaning | Specification | | :--- | :--- | :--- | | **CTLL** | Series Prefix | Multilayer Chip Inductor (Standard Low Inductance) | | **2012** | Package Size | EIA 0805 (Metric 2012): $2.0mm \times 1.25mm$ | | **R18** | Inductance Value | $0.18 \mu H$ (180nH) | | **J** | Tolerance | $\pm 5\%$ | --- ### 2. Key Electrical Specifications Below are the typical technical parameters for this specific part: * **Inductance:** $0.18 \mu H$ (measured at a specific test frequency, usually 25MHz). * **Tolerance:** $\pm 5\%$. * **Quality Factor (Q):** Usually ranges between 15 and 25 (minimum), representing the efficiency of the inductor. * **Self-Resonant Frequency (SRF):** Typically high (approx. 400MHz - 500MHz), allowing it to operate effectively in RF ranges. * **DC Resistance (DCR):** Low resistance (approx. $0.40 \Omega - 0.70 \Omega$) to minimize power loss and heat. * **Rated Current:** The maximum current it can carry (typically around $200mA - 300mA$) without overheating or saturating. --- ### 3. Physical Construction The CTLL2012-R18J is a **Multilayer Inductor**, which differs from wire-wound inductors: * **Internal Structure:** It consists of layers of ceramic material screen-printed with conductive paste (usually silver) to form a coil shape inside the body. * **Materials:** Ferrite or Ceramic base depending on the specific frequency target. * **Termination:** Tin-plated (lead-free) electrodes for standard SMT soldering processes. --- ### 4. Common Applications Due to its small size and precise inductance, it is frequently found in: 1. **RF Matching:** Matching impedance in wireless communication devices (Wi-Fi, Bluetooth). 2. **Signal Filtering:** Removing high-frequency noise from signal lines. 3. **Decoupling:** Preventing interference between different stages of a high-speed circuit. 4. **Mobile Electronics:** Used in smartphones and tablets where space is at a premium. ---
    ✨ Follow-up Questions
    • What is the difference between a multilayer inductor and a wire-wound inductor in terms of performance?
    • How does the SRF (Self-Resonant Frequency) impact the usage of the CTLL2012-R18J?
    • Are there alternative tolerances available for the CTLL2012 series?